Investigation of Electroless Deposited Films as the Diffusion Barrier of Pb-Sn Solder
博士 === 國立交通大學 === 材料科學與工程系所 === 96 === Under bump metallization (UBM) provides good adhesion between the bonding pads and the bumps, and serves as a diffusion barrier, wetting, and protective layer for flip-chip bonding. Both Au and Cu are so-called fast diffusers in Sn, and can diffuse very long di...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/89341774076790704388 |