Effects of Bump Height on Electromigration Failure Time and Failure Modes of Eutectic SnAg Solder Joints
碩士 === 國立交通大學 === 材料科學與工程系所 === 96 === As the size of the microelectronic devices continues to shrink, the size and the bump height of solder joints continue to decrease. Effects of bump height on electromigration failure time and failure modes have not been studied for Pb-free SnAg solder joints. I...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59656112889754089277 |