Effects of Bump Height on Electromigration Failure Time and Failure Modes of Eutectic SnAg Solder Joints

• Main Authors: Min-Feng Ku, 顧旻峰
• Other Authors: Chih Chen
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/59656112889754089277

碩士 === 國立交通大學 === 材料科學與工程系所 === 96 === As the size of the microelectronic devices continues to shrink, the size and the bump height of solder joints continue to decrease. Effects of bump height on electromigration failure time and failure modes have not been studied for Pb-free SnAg solder joints. In this study, we fabricated two kinds of solder joints with different bump heights: low-bump-height (LBH) of 25 μm, and high-bump-height (HBH) of 75μm. Both sets of solder joints were subjected to electromigration tests by 0.9A at 150℃. We measured the changes of bump resistance with Kelvin bump probes. We define the bump failure when the bump resistance increased 20％ of its initial value. According to the temperature results measured by infrared microscope, we found different Joule heating increase in the two solder joints, is responsible for the difference in failure time.