Development of Electroless Ru Deposition for Barrier Layers in Cu Damascence Structure
碩士 === 國立交通大學 === 材料科學與工程系所 === 96 === The objective for this research is to develop a new formulation for Ru electroless plating to deposit a Ru thin film with considerable surface uniformity and thermal stability on several substrates. We investigated the diffusion barrier properties of Ru (25-50...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/19168376525825960403 |