Electromigration study in SnCu solder joints with Ti/Ni(V)/Cu thin-film under-bump-metallization and Cu substrate pad
碩士 === 國立交通大學 === 材料科學與工程系所 === 96 === In this study, electromigration study in SnCu lead-free solder joints with thin-film under-bump-metallization and Cu substrate pad was conducted. We found that there was sever damage on the substrate side (anode side), and the damage on chip side (cathode side)...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/92906745573277833040 |