Measurement of electromigration activation energy of eutectic SnPb flip-chip solder joints with Cu/Ni and Cu thick-film Under-bump-metallization
碩士 === 國立交通大學 === 材料科學與工程系所 === 96 === Activation energy of electromigration is investigated in eutectic SnPb flip-chip solder joints with thick under-bump-metallizations (UBMs) of 5-μm Cu/3-μm Ni and 5-μm Cu. We fabricate the Kelvin probes to monitor the bump resistance during the current stressing...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11294300642094756292 |