The Study of Interfacial Reaction and Solder Joints Strength of Sn-0.7Cu-xZn Lead-free Solder
碩士 === 國立交通大學 === 機械工程系所 === 96 === The effects of Zn additions on the interfacial reactions with Cu substrates of Sn-0.7Cu (all in wt.% unless specified otherwise) Pb-free solders were investigated. This study was focused on the intermetallic compound (IMC) growth, interfacial reaction and the join...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24784408658868663343 |