Effects of Underfills on Gold-to-Gold Reliability for High Frequency Flip-Chip Packaging
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 96 === As the proliferation of high-quality mobile communication increased recently, the demand of large bandwidth of communication increased recently, too. As a result, several communication specifications was developed, such as GPRS、3G、Bluetooth、802.11n…e...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/21125113783595131198 |