Study of EM(Electromigration) failure modes at Sn/Cu cathode interface in Flip-chip solder joint
博士 === 國立中央大學 === 化學工程與材料工程研究所 === 96 === As the speed and function of the CPU continuous to increase, I/O count (Input-Output) also increases dramatically. According to the semiconductor roadmap, by 2007 the current density for each C4 solder bump will exceed 104 A/cm2. Two EM failure modes have...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/88675413014183696974 |