Effect of Cu substrate grain size and orientation on Sn/Cu soldering reaction
碩士 === 國立中央大學 === 材料科學與工程研究所 === 96 === The binary Cu/Sn soldering system is the most important joint system in the current IC packaging and assembly industry. Although, the simple Sn/Cu reaction has been studied for a very long history, still, there are lots of research going on to understand it m...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/18613156728278917493 |