Effect of Cu substrate grain size and orientation on Sn/Cu soldering reaction
碩士 === 國立中央大學 === 材料科學與工程研究所 === 96 === The binary Cu/Sn soldering system is the most important joint system in the current IC packaging and assembly industry. Although, the simple Sn/Cu reaction has been studied for a very long history, still, there are lots of research going on to understand it m...
Main Authors: | Tzu-ming Huang, 黃咨鳴 |
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Other Authors: | Cheng-yi Liu |
Format: | Others |
Language: | zh-TW |
Published: |
2008
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Online Access: | http://ndltd.ncl.edu.tw/handle/18613156728278917493 |
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