Dissimilar Material Wafer Bonding - Silicon on Quartz THIM FILMSTRESSES SIMULATION and STUDY
碩士 === 國立中央大學 === 機械工程研究所 === 96 === One of the characteristics of wafer bonding technology is joining different materials, therefore, it can provide possibility of integration to all kinds of wafer. The quartz and silicon bonded wafer can be widely used in MEMS, CCD and micro-display. But in the an...
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| Format: | Others |
| Language: | zh-TW |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53119912168932309030 |