Thermosonic Bonding Process Optimization of the Gold to Gold Interconnection on LED Flip Chip and Substrate
碩士 === 國立彰化師範大學 === 機電工程學系 === 96 === The thermosonic bonding parameters on LEDs involve different bonding temperatures, different bonding force, different bonding time and different ultrasonic power. Using a simple thrust machine created the shearing force for bonding force investigation. Experimen...
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| Format: | Others |
| Language: | zh-TW |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56061614653102949240 |