Analysis of LCD Outer Lead Bonding Process Parameter Optimization with Taguchi Method
碩士 === 國立彰化師範大學 === 機電工程學系 === 96 === The reliability problem between glass board and COF combination mostly occurred in different components combination. Does it reach the lowest need that negative electric tape spread in IC bump area? How many pressures will be increased in the procedure then the...
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| Format: | Others |
| Language: | zh-TW |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72437661345255987028 |