Structural stress simulation and molding compound property measurements of the chip-on-board package
碩士 === 國立屏東科技大學 === 材料工程所 === 96 === In this study, the characteristics of the molding compound and structural stress of the chip-on-board package (the five chip placement on the BT substrate). The curing behavior of the molding compound was studied by DSC instrument for assuring the molding compoun...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86753626343973573916 |