The Design of Auto-heating System in LED Wafer

• Main Authors: Chin-Yung Wang, 王志湧
• Other Authors: Yi-Hong Lin
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/68988919779842531557

碩士 === 國立屏東科技大學 === 機械工程系所 === 96 === Recently, The promotion in LED(Light Emitting Diode) throughput and light density, the complexity of element figure in micro-photo process and line width shrinkage , photo-resist dosage solidification in thin film process , more difficult control in soft and hard bake. Adopting adaptive designed idea by Autodesk Inventor 3D software Designs a automatic chip heating system, in hardware field, semi-automatic transport chip and uniform temperature to supply superior uniform heating then enhancing process stability. To reduce human mistake by automatized and cause poor quality due to photo-resist dosage solidification avoid scratch during manual loading up/down chip, For software design and process condition records monitor principle to enhance the yield of chip. From experiment obtains real measurement result, control heating temperature around 150℃ ,The deviation can be controlled under 4 ℃ for whole heating range to meet process criteria.