The Design of Auto-heating System in LED Wafer
碩士 === 國立屏東科技大學 === 機械工程系所 === 96 === Recently, The promotion in LED(Light Emitting Diode) throughput and light density, the complexity of element figure in micro-photo process and line width shrinkage , photo-resist dosage solidification in thin film process , more difficult control in soft and har...
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ndltd-TW-096NPUS54890552016-12-22T04:12:09Z http://ndltd.ncl.edu.tw/handle/68988919779842531557 The Design of Auto-heating System in LED Wafer 晶片加熱自動化系統之設計 Chin-Yung Wang 王志湧 碩士 國立屏東科技大學 機械工程系所 96 Recently, The promotion in LED(Light Emitting Diode) throughput and light density, the complexity of element figure in micro-photo process and line width shrinkage , photo-resist dosage solidification in thin film process , more difficult control in soft and hard bake. Adopting adaptive designed idea by Autodesk Inventor 3D software Designs a automatic chip heating system, in hardware field, semi-automatic transport chip and uniform temperature to supply superior uniform heating then enhancing process stability. To reduce human mistake by automatized and cause poor quality due to photo-resist dosage solidification avoid scratch during manual loading up/down chip, For software design and process condition records monitor principle to enhance the yield of chip. From experiment obtains real measurement result, control heating temperature around 150℃ ,The deviation can be controlled under 4 ℃ for whole heating range to meet process criteria. Yi-Hong Lin 林宜弘 2008 學位論文 ; thesis 42 zh-TW |
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碩士 === 國立屏東科技大學 === 機械工程系所 === 96 === Recently, The promotion in LED(Light Emitting Diode) throughput and light density, the complexity of element figure in micro-photo process and line width shrinkage , photo-resist dosage solidification in thin film process , more difficult control in soft and hard bake.
Adopting adaptive designed idea by Autodesk Inventor 3D software Designs a automatic chip heating system, in hardware field, semi-automatic transport chip and uniform temperature to supply superior uniform heating then enhancing process stability.
To reduce human mistake by automatized and cause poor quality due to photo-resist dosage solidification avoid scratch during manual loading up/down chip, For software design and process condition records monitor principle to enhance the yield of chip.
From experiment obtains real measurement result, control heating temperature around 150℃ ,The deviation can be controlled under 4 ℃ for whole heating range to meet process criteria.
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author2 |
Yi-Hong Lin |
author_facet |
Yi-Hong Lin Chin-Yung Wang 王志湧 |
author |
Chin-Yung Wang 王志湧 |
spellingShingle |
Chin-Yung Wang 王志湧 The Design of Auto-heating System in LED Wafer |
author_sort |
Chin-Yung Wang |
title |
The Design of Auto-heating System in LED Wafer |
title_short |
The Design of Auto-heating System in LED Wafer |
title_full |
The Design of Auto-heating System in LED Wafer |
title_fullStr |
The Design of Auto-heating System in LED Wafer |
title_full_unstemmed |
The Design of Auto-heating System in LED Wafer |
title_sort |
design of auto-heating system in led wafer |
publishDate |
2008 |
url |
http://ndltd.ncl.edu.tw/handle/68988919779842531557 |
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