On the effectiveness of high-entropy alloy/nitride thin films as diffusion barrier for copper metallization

博士 === 國立清華大學 === 材料科學工程學系 === 96 === The aim of this study is to test the effectiveness of high-entropy alloy/nitrides as diffusion barrier layer for copper metallization. A new HEA composition, AlMoNbSiTaTiVZr, is specifically designed for this purpose. We first deposited various (AlMoNbSiTaTiVZr)...

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Bibliographic Details
Main Authors: Ming-Hung Tsai, 蔡銘洪
Other Authors: Jien-Wei Yeh
Format: Others
Language:en_US
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/69062958620625376955