On the effectiveness of high-entropy alloy/nitride thin films as diffusion barrier for copper metallization
博士 === 國立清華大學 === 材料科學工程學系 === 96 === The aim of this study is to test the effectiveness of high-entropy alloy/nitrides as diffusion barrier layer for copper metallization. A new HEA composition, AlMoNbSiTaTiVZr, is specifically designed for this purpose. We first deposited various (AlMoNbSiTaTiVZr)...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/69062958620625376955 |