| Summary: | 碩士 === 國立清華大學 === 微機電工程研究所 === 96 === Multilayer high-aspect-ratio metal technology consists of several conventional semiconductor fabrication techniques, including the photolithography process, micro-electroplating process and chemical mechanical polishing (CMP) process. Compared to bulk micromachining and surface micromachining, this technology shows better performance to fabricate multilayer high-aspect-ratio structures.
In this study, the electroplating mirco molds were defined by photolithography process, and then deposited structure and sacrificial layers by using the micro-electroplating process. These electroplated structures were planarized by lapping and chemical mechanical polishing process. Repetition of previous processes completed the stacking of micro structures. The desired micro device was formed by selective metal etching process, and the electroplated metals are copper and nickel in the thesis.
Vertical comb drive micromirror is made by multilayer high-aspect-ratio metal technology in the thesis. An one degree of freedom micromirror was made by stacking three layers microstructures, and a two degree of freedom micromirror composed six layers microstructures. There is a dielectric layer in the 4th layer of the 2D mirror. The tilting angle of 1D mirror was measured as two degrees.
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