The Investigation of Thermal Characterization by the Effect of Power Cycle on the Package Chip
碩士 === 北台灣科學技術學院 === 機電整合研究所 === 97 === In the first part of this research, a measurement fixture which can make measurements on the thermal test chip with both RTD and diode thermal sensors simultaneously was developed. The corresponding strategy of the RTD and diode thermal sensors was also discus...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05201721296403510432 |