Silicon wafer through-holes fabricated by photo-assisted electrochemical etching
碩士 === 國立臺灣師範大學 === 機電科技研究所 === 96 === This research developed photo-assisted electrochemical etching (PAECE) system with low-cost light source for fabricating high-density silicon wafer through-holes array. This process is described as followed: high-density through-holes array in silicon is etched...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/gxf929 |