The Effect of Germanium Additions on the Properties of SnAgCu-RE Solder
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 96 === Ternary Sn-Ag-Cu alloys have been recommended as potential candidates to replace the eutectic Sn-37Pb alloy as a major Pb-free solder. Due to the higher melting temperature and poorer wettability of the Sn-Ag-Cu solder, many researchers have tried to improve...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/99286259776542495102 |