Heat Transfer Analysis of a Loop Heat Pipe with Biporous Wicks

碩士 === 國立臺灣大學 === 機械工程學研究所 === 96 === In recent years, the high-power electronic devices cause the increasing demand of heat dissipation. Thus, how to improve the heat transfer capacity of a loop heat pipe (LHP) by the wick structure will be an important topic. The purpose of this article is to disc...

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Bibliographic Details
Main Authors: Chun-Nan Chen, 陳俊男
Other Authors: Yau-Ming Chen
Format: Others
Language:en_US
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/40969420730557999181