Study on Dressing Behaviors in Chemical Mechanical Polishing
碩士 === 國立臺灣大學 === 機械工程學研究所 === 96 === Chemical mechanical polishing (CMP) is the planarization technology most often used for semiconductor processes. The polishing pad needs to be dressed by a dresser to maintain the stability and the throughput of the planarization process. This study simulated an...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91421238731006956993 |