Vibration Induced Fatigue Reliability Analysis of BGA Packages
碩士 === 國立臺灣大學 === 機械工程學研究所 === 96 === It has been pointed out that vibration induced fatigue of solder balls is one of the major failure mechanisms of ball grid array (BGA) packages. Therefore, in the present paper, the life and reliability of a BGA package is studied in consideration of fatigue of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16269463992410792160 |