The Study of Interfacial Reactions betweenSn-9Zn Lead-Free Solder and Au/Ni/SUS304 Substrate

碩士 === 國立臺灣科技大學 === 材料科技研究所 === 96 === Lead-free solder as Sn-9Zn so cheap has attracted extensive studies recently. On the other hand, the interfacial reaction between the Sn-9Zn based solders and Au/Ni/SUS304 substrate were rarely studied before. This study investigated the interfacial reaction be...

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Bibliographic Details
Main Authors: Kuo-Sing Chao, 趙國興
Other Authors: Yen Yee-Wen
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/18773701313878883383