The Study of the Influence of Lead Frame Oxidation on the Semiconductor Package
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 96 === This research focuses on the influences of lead frame oxidization to BTM de-lamination. During the semiconductor assembly processes, lead frame goes through high temperature baking process which triggers lead frame oxidization. In this research, it...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60090382906417622113 |