The properties of copper using electroplating for blind filling in advanced electronic package
碩士 === 國立聯合大學 === 化學工程學系碩士班 === 96 === With the miniaturization of electronic devices,the connection reliability between integrated circuits(IC)and the external circuits has become important. A shorter connection between the IC chip and the substrate is demanded with the downsizing of circuit packag...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75964152649694224797 |