The packing process and characterization of measurement for high power surface-mount light-emitting diode
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 96 === In this study, LED ( Light Emitting Diode ) packaging process was introduced; lead frame cleaning, die fixing, wire bonding. The SMD ( Surface Mount Device ) technology and two different kinds of LED packaging substrates ( sample A, B ) were used to accompli...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/kx2m6h |