The packing process and characterization of measurement for high power surface-mount light-emitting diode

碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 96 === In this study, LED ( Light Emitting Diode ) packaging process was introduced; lead frame cleaning, die fixing, wire bonding. The SMD ( Surface Mount Device ) technology and two different kinds of LED packaging substrates ( sample A, B ) were used to accompli...

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Bibliographic Details
Main Authors: Yuan-Ching Yu, 游元慶
Other Authors: Teen-Hnng Meen
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/kx2m6h

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