Trial preparation of printed circuit board by Kevlar paper.
碩士 === 中國文化大學 === 材料科學與奈米科技研究所 === 96 === In this study, we used Kevlar fiber that because it has excellent properties such as low density, high tensile strength, high tensile modulus, low moisture content and negative thermal expansion coefficient (TEC)，and we also used this fiber to manufacture th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83928204180174466401 |