LED Package Wire Bonding Performance Analysis
碩士 === 大同大學 === 機械工程學系(所) === 96 === Wire Bonding is the one of the major circuit connection methods in current electronic packaging processes, which can enable the completion of circuit connectivity for chips or wafers with packaging substrate or Lead frame so as to achieve the purpose of electroni...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04921650589675330483 |