| Summary: | 碩士 === 大同大學 === 機械工程學系(所) === 96 === Wire Bonding is the one of the major circuit connection methods in current electronic packaging processes, which can enable the completion of circuit connectivity for chips or wafers with packaging substrate or Lead frame so as to achieve the purpose of electronic signal transmission. Wire bonding is part of the electronic packaging process, and its major function is to ensure the signal transmission between the electronic components, therefore the good wire bonding quality can accurately in addition to effectively transmit signals as intended. Currently, the trending for LED packaging components are leaning towards thinner and smaller, in comparison to the vital role assumed by wire bonding in the integral LED packaging process. Thus, among all the wire bonding quality indices, the values from forces of pulling and pushing will be used as inspection values for parameter modifications or fine-tuning efforts. This research is primarily based on LED packaging and it applies the comparisons between traditional wire bonding approach (Single) with current wire bonding approach (BSOB), as well as through the experimentation method, it placed the inspection results from the pulling and pushing values under the application of control charts to prove that, by using BSOB approach, it would create trustworthy product quality. Lastly, this research intends to find out and come up with enhancement strategies in regard to the causes for negatively influencing the wire bonding fabrications. Finally, this research applies case study for negativity analysis to prove the importance of pulling and pushing forces.
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