A Thermal-Aware Load Balancing onMulticore Architecture
碩士 === 國立中正大學 === 資訊工程所 === 97 === With the power density increases very rapid in chip, thermal issues have become an important issue. The heat generates with power thus has an effect upon reliability of the processor because of mainly using one of function units on chip. Unevenly distributed power...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/84589297557515957129 |