Design of the JEDEC Standard Board-Level Drop Test Apparatus
碩士 === 中華大學 === 機械工程學系碩士班 === 97 === Solder joint reliability plays a great concern to semiconductor and electronic product manufacturers. In the past years, thermal cycling test to solder joints fatigue strength has been investigated vigorously. Due to rapid advancements in the electronic industry,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09697264948184916277 |