An Investigation of the Metal Deposition Process with the Compensation of Substrate Position Effect

碩士 === 正修科技大學 === 機電工程研究所 === 97 === As study on the density of metal film on substrate is considered in this investigation. There are material characteristic and reaction magnetic field issue during metal films deposition(Sputtering), and there has stress issue after the metal film deposited upon t...

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Bibliographic Details
Main Authors: Huang, Wen-Yi, 黃文藝
Other Authors: 黃柏文
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/96146966587384222058