Optimum Design for Gold Stud Bump Thermo-compression Flip Chip Bonding Process by Applying DOE Method
碩士 === 中原大學 === 工業與系統工程研究所 === 97 === Over the years, flip chip has become the major interconnection method of high performance packages such as microprocessors, graphics chipsets, high speed memory and high-end ASICs. Flip chips apply in some high volume consumer product such as PC peripherals, mob...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94700717516670594067 |