The Design and Analysis of Passive ComponentBonding Pad for Miniaturization
碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 97 === The bonding pad design standard has not been established yet for the will be mainstream miniature passive component 0201. Though factors like the offset of Chip Shooter, pad design, furnace temperature of Reflow Oven, and lead-free solder paste are all expec...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80851867847399197487 |