A study of grinding characteristics for UV-LIGA fabrication of micro-type diamond wheelsA study of grinding characteristics for UV-LIGA fabrication of micro-type diamond wheelsA study of grinding characteristics for UV-LIGA fabrication of micro-type d

• Main Authors: Jhong-Ning Huang, 黃仲寧
• Other Authors: Shenq-Yih Luo
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/93781450634388820075

碩士 === 華梵大學 === 機電工程學系博碩專班 === 97 === The purpose of this paper is to develop a micro type diamond wheel combined a micro arbor that can be applied to precision micro grinding. Joining method between the micro wheel and the micro arbor was investigated and the grinding process for the silicon wafer and sodium calcium glass was established. The experiment results showed that using a micro type diamond wheel with a micro arbor of tool steel SKD61 was fabricated to grind silicon wafer and sodium calcium glass under a lower feed rate, the resulting material removal efficiency was relatively higher. For the same spindle speed, when the micro wheel under a lower depth of cut was employed, the material removal efficiency obtained was relatively better. Oppositely, the more the depth of cut was, the poorer the material removal efficiency was obtained. The reason for this is that a higher depth of cut during the micro grinding will cause a larger deformation of micro arbor. When the micro type diamond wheel during the grinding at a lower depth of cut, a slower spindle speed, and a lower feed rate was used, the material removal efficiency produced was relatively better. Besides, the silicon wafer and sodium calcium glass ground by a micro type diamond wheel during the micro grinding displayed mainly a ductile appearance, but the edges of grinding groove showed a brittle fracture.