Treatment of real CMP wastewater from semiconductor fabrication by electrocoagulation
碩士 === 弘光科技大學 === 職業安全與防災研究所 === 97 === In the presently semiconductor industry, chemical mechanical polishing (CMP) has become the key technique to provide global planarization on interlevel dielectrics and metal layers of wafers. In general, post-CMP cleaning requires a huge volume of ultrapure wa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42677086003189741397 |