Parametric Study and Optimum Design for Chip of Circuit Under Pad
碩士 === 義守大學 === 電子工程學系碩士班 === 97 === In the semiconductor industry, the CUP (circuit under pad) structure is developed in the advance technology of Fab manufacture, the Cu/Low K material with the CUP structure has been designed to get more space for active circuit layout. since the electronics devic...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66315434331377168298 |