The Material Characteristics of Gold Wire/Copper Wire and Dynamic Response on Bonding Process
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 97 === Wirebonding assembly has been widely used in the semiconductor package for the past two decades. The welding wire bonding technology is based on electricity as a link and as the transmission of signals. Material strength of copper wire is higher than gold w...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/71578047131210425689 |