The Investigation on the Microstructures, Mechanical and Wetting Properties of Sn-Zn-Ag-Al-xIn Alloys for the Electronic Material
碩士 === 國立高雄應用科技大學 === 光電與通訊研究所 === 97 === The microstructures, mechanical properties and wettability of Sn-8.55Zn-0.5Ag-0.01Al-xIn (x = 1, 3, 5 and 7.5 wt.%) lead-free solder alloys were investigated. The study found the best composition to replace Sn-Pb solder. Microstructure of Sn-8.55Zn-0.5Ag sho...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/61793671702391531449 |