Effect of crack under temperature cycle test for drop in heat slug quad flat package(QFP)
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 97 === Considering process and cost, the heat slug do not attach on die pad backside of drop-in heat slug quad flat package (QFP).But it will affect crack phenomenon between heat slug and die pad during temperature cycle test (TCT) due to the coefficient of therm...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02428542308453487755 |