Study on Optimal Parameters for Wire Bonding Efficiency in IC Package Processes
碩士 === 國立高雄應用科技大學 === 電子工程系 === 97 === Wire bonding is a critical process in IC package, which is mainly to deliver electric signal between the many components. Good wire bonding quality can guarantee correct and effective signal transmission. Therefore, understanding the process of wire bonding can...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81002485571014765744 |