Study on Improvement Oxidation Effects for Lead-Frame Products in Assembly Processes
碩士 === 國立高雄應用科技大學 === 電子工程系 === 97 === For package process, it is especially very important to the lead-frame products that the controlling properly of stage time can improve the quality. The copper products in the high temperature are easy to be influenced by oxygen in the air. It is very serious t...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/40567289962501250193 |