Failure Analysis of Integrated Circuits Contaminated by Metal Particles in Package Process
碩士 === 明新科技大學 === 電子工程研究所 === 97 === In present, the manufacturing technology and equipment development in semiconductor fields are very advanced due to the market competition. However, the investment of the package technology, in contrast, is less that that of the previous. Therefore, in the packag...
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| Format: | Others |
| Language: | zh-TW |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62522408105098417630 |