Interfacial reactions of Au-20wt.%Sn solder on Cu substrate
碩士 === 國立中興大學 === 化學工程學系所 === 97 === Eutectic Au-20wt%.Sn (Au20Sn) solder alloy is commonly used in bonding applications for microelectronic and optoelectronic packages. The copper is a common substrate used in electronic equipment. The subject of this study is to investigate the microstructure evol...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36040278804199707816 |