Analysis of Warpage Issue in Flip-Chip Ball Grid Arrays
碩士 === 國立中興大學 === 材料科學與工程學系所 === 97 === The thesis seeks to discuss in detail the best material and adhesive dispense matrix combination for reducing the thermal stress (package warpage) effect on a flip chip package at reflow temperature conditions. In this study, the Shadow Moiré Method was utili...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/36747905694254856836 |