High-Speed Digital Interface Integration in Consumer Electronics–From Package to Motherboard Design
博士 === 國立中興大學 === 電機工程學系所 === 97 === The technology trend in the consumer electronics can be summarized as more functionalities in a smaller geometry with low cost. Before the low cost system will be achieved, the integration of chip, package, and board must be verified with good enough performance...
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| Format: | Others |
| Language: | en_US |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06346587282287622018 |